Method for Manufacturing a Semiconductor Wafer, and Semiconductor Device Having a Low Concentration of Interstitial Oxygen

ABSTRACT

A method for manufacturing a substrate wafer  100  includes providing a device wafer ( 110 ) having a first side ( 111 ) and a second side ( 112 ); subjecting the device wafer ( 110 ) to a first high temperature process for reducing the oxygen content of the device wafer ( 110 ) at least in a region ( 112   a ) at the second side ( 112 ); bonding the second side ( 112 ) of the device wafer ( 110 ) to a first side ( 121 ) of a carrier wafer ( 120 ) to form a substrate wafer ( 100 ); processing the first side ( 101 ) of the substrate wafer ( 100 ) to reduce the thickness of the device wafer ( 110 ); subjecting the substrate wafer ( 100 ) to a second high temperature process for reducing the oxygen content at least of the device wafer ( 110 ); and at least partially integrating at least one semiconductor component ( 140 ) into the device wafer ( 110 ) after the second high temperature process.

The present application claims priority under 35 USC §119 to German (DE)Patent Application Serial No. DE 10 2014 114 683.2 filed on Oct. 9,2014. The disclosure in this priority application is hereby incorporatedfully by reference into the present application.

BACKGROUND

1. Technical Field

Embodiments described herein relate to methods for manufacturingsemiconductor wafers, and to semiconductor devices having a lowconcentration of interstitial oxygen. Further embodiments relates tomethods for manufacturing semiconductor wafers having a resistivity in agiven range.

2. Background Art

Semiconductor devices are processed on semiconductor wafers which arethin plates of cut large semiconductor crystals, which are referred toas ingots. There are basically two different methods to producesemiconductor ingots: methods based on Czochralski process (CZ process)and methods based on the float-zone process (FZ process). The FZ processallows manufacturing of ingots with a very low concentration of lightimpurities. However, the size of the ingots which can be produced by FZprocesses is limited to about 200 mm in diameter. Furthermore, FZprocesses are more expensive than CZ processes. Different to FZprocesses, ingots having a large diameter of 300 mm (12 inch) or largercan be manufactured by CZ processes.

For certain devices such as IGBTs a low concentration of interstitialoxygen and a high intrinsic resistivity in a given range are desirable.FZ processes allow the manufacturing of ingots having a sufficiently lowconcentration of interstitial oxygen at high cost. The concentration ofoxygen in CZ crystals is inherently higher than for FZ crystals since aquartz crucible is in direct contact with the hot melt which adds oxygento the melt. To adjust the resistivity of CZ ingots, dopants can beadded to the molten semiconductor material. However, due the segregationeffect, the dopants are enriched in the molten semiconductor materialduring formation of the ingot. The manufactured CZ ingot thus has adoping gradient in its longitudinal direction of 50% or more. Such avariation is too large for many semiconductor devices, particularlypower devices, so that a large portion of the ingots cannot be used forthe intended purpose. This further increases the manufacturing costs.

In view of the above, there is a need for improvement.

SUMMARY

According to an embodiment, a method for manufacturing a substrate waferincludes: providing a device wafer having a first side and a second sideopposite the first side, the device wafer being made of a semiconductormaterial and having a first thickness; subjecting the device wafer to afirst high temperature process for reducing the oxygen content of thedevice wafer at least in a region at the second side; bonding the secondside of the device wafer to a first side of a carrier wafer to form asubstrate wafer comprising the device wafer bonded to the carrier wafer,the carrier wafer having a second side opposite the first side whichsecond side of the carrier wafer forms the second side of the substratewafer, wherein the first side of the device wafer forms a first side ofthe substrate wafer; processing the first side of the substrate wafer,which is formed by the first side of the device wafer, to reduce thethickness of the device wafer to a second thickness which is less thanthe first thickness of the device wafer; subjecting the substrate waferto a second high temperature process for reducing the oxygen content atleast of the device wafer bonded to the carrier wafer; and at leastpartially integrating at least one semiconductor component into thedevice wafer after the second high temperature process.

According to an embodiment, a method for manufacturing a substrate waferincludes: determining the oxygen concentration distribution of one ormore monocrystalline ingots of a semiconductor material, wherein theingot is particularly a CZ ingot or an MCZ ingot; selecting at least afirst region of the one or more monocrystalline ingots having an oxygenconcentration which is below a given oxygen threshold; selecting atleast a second region of the one or more monocrystalline ingots havingan oxygen concentration which is above the given threshold; slicing thefirst region to form at least a first semiconductor wafer; slicing thesecond region to form at least a second semiconductor wafer; bonding thefirst semiconductor wafer to the second semiconductor wafer.

According to an embodiment, a method for manufacturing a substrate waferincludes: determining the resistivity distribution of one or moremonocrystalline ingots of a semiconductor material, wherein the ingot isparticularly a CZ ingot or an MCZ ingot; selecting at least a firstregion of the one or more monocrystalline ingots having a resistivitywithin a given resistivity range; selecting at least a second region ofthe one or more monocrystalline ingots having a resistivity outside agiven resistivity range; slicing the first region to form at least afirst semiconductor wafer; slicing the second region to form at least asecond semiconductor wafer; bonding the first semiconductor wafer to thesecond semiconductor wafer.

According to an embodiment, a semiconductor device includes asemiconductor substrate, particularly a monocrystalline siliconsubstrate, having a first side, a second side opposite the first side,and a thickness. The semiconductor device further includes at least onesemiconductor component integrated in the semiconductor substrate, afirst metallization at the first side of the semiconductor substrate,and a second metallization at the second side of the semiconductorsubstrate. The semiconductor substrate has an oxygen concentration alonga thickness line of the semiconductor substrate which has a globalmaximum at a position of 20% to 80% of the thickness relative to thefirst side, wherein the global maximum is at least 2-times larger,particularly at least 5-times larger, than the oxygen concentrations ateach of the first side and the second side of the semiconductorsubstrate.

Those skilled in the art will recognise additional features andadvantages upon reading the following detailed description, and uponviewing the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the figures are not necessarily to scale, insteademphasis being placed upon illustrating the principles of the invention.Moreover, in the figures, like reference signs designate correspondingparts. In the drawings:

FIGS. 1A to 1G illustrate processes of a method for manufacturing asubstrate wafer according to an embodiment;

FIGS. 2A to 2J illustrate processes of a method for manufacturing asubstrate wafer according to an embodiment;

FIG. 3 illustrates the oxygen concentration after thermal processes atdifferent temperature and time;

FIG. 4 illustrates a semiconductor device according to an embodiment;

FIG. 5 illustrates the oxygen distribution in the device wafer afterdifferent processes according to an embodiment;

FIGS. 6A to 6C illustrate processes of a method for manufacturing asubstrate wafer according to an embodiment; and

FIGS. 7A to 7D illustrate processes of a method for manufacturing asubstrate wafer according to an embodiment.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings, which form a part hereof, and in which are shownby way of illustration specific embodiments in which the invention maybe practiced. In this regard, directional terminology, such as “top”,“bottom”, “front”, “back”, leading”, “trailing”, “lateral”, “vertical”etc., is used with reference to the orientation of the Figure(s) beingdescribed. Because components of embodiments can be positioned in anumber of different orientations, the directional terminology is usedfor purpose of illustration and is in no way limiting. It is to beunderstood that other embodiments may be utilised and structural orlogical changes may be made without departing from the scope of thepresent invention. The following detailed description, therefore, is notto be taken in a limiting sense, and the scope of the present inventionis defined by the appended claims. The embodiments being described usespecific language, which should not be construed as limiting the scopeof the appended claims.

In this specification, a second surface of a semiconductor substrate isconsidered to be formed by the lower or back-side surface while a firstsurface is considered to be formed by the upper, front or main surfaceof the semiconductor substrate. The terms “above” and “below” as used inthis specification therefore describe a relative location of astructural feature to another structural feature with consideration ofthis orientation.

The terms “electrical connection” and “electrically connected” describesan ohmic connection between two elements.

An embodiment is described next with reference to FIGS. 1A to 1G.Furthermore, FIGS. 1B, 1C, 1D and 1F illustrate processes according toan embodiment, while FIGS. 1A, 1E, and 1G illustrates optionalprocesses. FIGS. 7A and 7D describe a more general embodiment whichbasically corresponds to an embodiment of FIGS. 1B, 1C, 1D and 1F.

A device wafer 110 having a first side 111 and a second side 112opposite the first side 111 is provided. The device wafer 110 is cutfrom an ingot formed by a CZ process, which also includes magnetic CZprocesses (MCZ processes). The device wafer 110 is made of asemiconductor material.

CZ processes are more cost efficient than FZ processes and allowsmanufacturing of ingots having a larger diameter. According to anembodiment, the device wafer 110 has a diameter of at least 150 mm (6inch), particularly of at least 200 mm (8 inch), and even moreparticularly of at least 250 mm (10 inch) such as 300 mm (12 inch).Larger device wafers 110 allow the integration of more semiconductordevices and thus lead to a reduction of manufacturing costs.

The device wafer 110 can be made of any semiconductor material suitablefor manufacturing semiconductor components. Examples of such materialsinclude, without being limited thereto, elementary semiconductormaterials such as silicon (Si), group IV compound semiconductormaterials such as silicon carbide (SIC) or silicon germanium (Site),binary, ternary or quaternary III-V semiconductor materials such asgallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide(InP), gallium nitride (GaN), aluminium gallium nitride (AlGaN), indiumgallium phosphide (InGaPa) or indium gallium arsenide phosphide(InGaAsP), and binary or ternary II-VI semiconductor materials such ascadmium telluride (CdTe) and mercury cadmium telluride (HgCdTe) to namefew. The above mentioned semiconductor materials are also referred to ashomojunction semiconductor materials. When combining two differentsemiconductor materials a heterojunction semiconductor material isformed. Examples of heterojunction semiconductor materials include,without being limited thereto, silicon (Si_(x)C_(1-x)) and SiGeheterojunction semiconductor material. For power semiconductorapplications currently mainly Si, SiC and GaN materials are used.

According to an embodiment, the semiconductor material is a group IVsemiconductor material such as Si.

According to another embodiment, the semiconductor material is a binaryII-VI semiconductor material.

The device wafer 110 typically has an intrinsic resistivity in a givenrange, which can be between about 20 Ohm*cm to about 240 Ohm*cm. Moreparticularly, the device wafer 110 can have a given intrinsicresistivity with a variation of the intrinsic resistivity of about equalto or less +/−15% or even of about equal to or less +/−8%. Depending onthe rated blocking voltage of the final semiconductor device to beintegrated in the device wafer 110, the given intrinsic resistivity canbe, for example, 30 Ohm*cm, 60 Ohm*cm, 120 Ohm*cm, or 180 Ohm*cm withany of the above mentioned variation ranges. The intrinsic resistivitycan be 30 Ohm*cm+/−15%, 60 Ohm*cm+/−8%, 120 Ohm*cm+/−30%, or 180Ohm*cm+/−15% to give just few specific illustrative examples. Furtherexamples are given further below.

Intrinsic resistivity refers to the resistivity of the semiconductormaterial of the ingot. The intrinsic resistivity is thus mainlydetermined by the process for manufacturing the ingot.

The device wafer 110 has a first thickness d1 which is typically largerthan the final thickness of the semiconductor device but smaller than athickness needed to handle the device wafer 110 without any carrierwafer bonded to it. For example, a device wafer having a diameter of 200mm (8 inch), which is referred to as 200 mm large device wafer, istypically about 725 μm thick to allow handling of the wafer without anyadditional carrier wafer. The device wafer 110 is typically thinner toavoid wasting too much expensive semiconductor material. The firstthickness d1 can be, for example, about 400 μm for a 200 mm large devicewafer 110. Typically, the first thickness d1 of the device wafer 110 isabout 300 μm to about 850 μm, depending on the final thickness of thesemiconductor devices and the size of the device wafer 110.

The device wafer 110 can have an initial interstitial oxygenconcentration, which is referred to as initial Oi concentration, ofequal to or less than 5*10¹⁷/cm³, particularly equal to or less than3*10¹⁷/cm³.

The Oi concentration of the device wafer 110 can be reduced by theprocesses as described herein so that device wafers 110 having a largerOi concentration can also be used which allows usages of device wafers110 which were otherwise discarded due their high initial Oiconcentration.

As illustrated in FIG. 1A, an optional oxide layer 118 can be formed onat least one of the first and second side 111, 112 of the device wafer110. Typically, the oxide layer 118 can be formed on both sides 111,112. In a further process, the oxide layer 118 is removed prior tosubjecting the device wafer 110 to a first high temperature process.

The optional oxide layer 118 can be formed, for example, by a thermaltreatment in an oxidizing atmosphere, for example at a temperaturebetween 1100° C. and 1180° C. for a time period between 2 h and 5 h.

Formation and removal of the optional oxide layer 118 reduces theso-called crystal originated particles, which are abbreviated as COPs.COPs can, for example, degrade gate oxides of the final semiconductordevices. Reducing the concentration of the COPs thus improves thequality of functional layers and reduces, for example, leak currentsthrough gate oxides.

In a process, as illustrated in FIG. 1B, and also in FIG. 7A the devicewafer 110 is subjected to a first high temperature process to reduce theoxygen content, i.e. the Oi concentration, of the device wafer 110 atleast in a region 112 a at the second side 112. The first hightemperature process typically reduces the Oi concentration at both sides111, 112 of the semiconductor wafer 110.

The first high temperature process can be carried out for 1 h to 20 h ata temperature between 1000° C. to 1300° C., typically between 1100° C.to 1200° C., in an inert atmosphere.

Alternatively, the first temperature process can be carried out for 1 hto 20 h at a temperature of equal to or less than 1100° C., for exampleless than 1050° C., in an oxidizing atmosphere such that the solidsolubility limit of interstitial oxygen is much lower than the originaloxygen concentration resulting in an effective out diffusion of oxygen.

The first high temperature process results in an out-diffusion of oxygenparticularly from regions close to the opposing surfaces of the devicewafer 110. The reduction of the Oi concentration at the surfaces can becarried out, depending on the temperature and duration of the first hightemperature process, by a factor of about 2 to 5 or even more relativeto the initial Oi concentration.

The reduction of the Oi concentration by the first high temperatureprocess is illustrated in FIG. 3 for two processes of differenttemperature and duration. Curve 61 illustrates the resulting Oiconcentration after a treatment at 1100° C. for 8 h and curve 62illustrates the resulting Oi concentration for a treatment at 1150° C.for 20 h. Both processes are in inert atmosphere. A reduction of the Oiconcentration relative to the initial Oi concentration, which isexpressed as bulk concentration, can be achieved in regions closer tothe exposed surfaces of the device wafer 110. For example, a region witha reduced 01 concentration of at least 50% extends to a depth of about30 μm relative to the surface when keeping the device wafer 110 at atemperature of about 1150° C. for 20 h. The longer the time period forthe first high temperature process, the deeper extend the region withreduced Oi concentration.

It would be possible to reduce the Oi concentration to less than 50% ofthe initial Oi concentration even in deeper regions or within the bulkof the device wafer 110. However, a very long first high temperatureprocess would be needed which is economically not feasible. To reducethe Oi concentration also in deeper regions, the approach as describedherein is used.

As illustrated in FIG. 1C, and also in FIG. 7B, the second side 112 ofthe device wafer 110 is bonded to a first side 121 of a carrier wafer120 to form a substrate wafer 100 which includes the device wafer 110bonded to the carrier wafer 120. The carrier wafer 120 can be of asemiconductor material and has a second side 122 opposite the first side121. The second side 122 of the carrier wafer 120 forms the second side102 of the substrate wafer 100, and the first side 111 of the devicewafer 110 forms a first side 101 of the substrate wafer 100. Forexample, the carrier wafer 120 can be of the same or of a differentsemiconductor material than the device wafer 110.

The carrier wafer 120 does not need to meet the specifications regardingthe intrinsic resistivity and Oi concentration, as the carrier wafer 120is finally removed and/or does not form part of the electronicallyactive regions of the final device.

For example, the carrier wafer 120 can be from the same ingot from whichthe device wafer 110 is cut but from a region of the ingot which doesnot meet the desired specification. Thus, a composite substrate wafer100 is formed which includes wafers from different regions of the sameingot. According to an embodiment, the carrier wafer 120 is from anotheringot than the device wafer 110.

Alternatively, the carrier wafer 120 is made of a non-semiconductormaterial and can be comprised of an amorphous or partially amorphousmaterial such as a glass material or graphite, or of a polycrystallinematerial. For protection, for example to protect graphite, the carrierwafer can include an encapsulating layer forming an oxygen barrier.

The first side 121 of the carrier wafer 120 and the second side 112 ofthe device wafer 110 are typically polished prior to bonding to haveflat surfaces for improved bonding quality. The polishing processes canbe carried out directly after cutting the wafers 110, 120 or shortlyprior to bonding.

According to an embodiment, each of the device wafer 110 and of thecarrier wafer 120 has the same diameter such as of at least 150 mm (6inch) or of at least 200 mm (8 inch).

The carrier wafer 120 can be subjected to a separate high temperatureprocess, which is referred to as third high temperature process, toreduce the oxygen content of the carrier wafer 120 prior to bonding thedevice wafer 110 to the carrier wafer 120. This is beneficial to reducethe Oi concentration close to the first side 121 of the carrier wafer120. The third high temperature process can be carried out at the sametemperature and duration as the first high temperature process.Alternatively, the third high temperature process can be longer and/orat a higher temperature than the first high temperature process toreduce the Oi concentration even more. The carrier wafer 120 can thushave a lower Oi concentration at its first side 121 than the devicewafer 110 has at its second side 112. The carrier wafer 120 cantherefore form a “sink” for oxygen so that oxygen diffuses from thedevice wafer 110 into the carrier wafer 120 during any further thermalprocess which is beneficial for keeping the Oi concentration within thedevice wafer 110 low. Alternatively the third high temperature processcan be shorter or/and at a lower temperature as the first two hightemperature processes.

According to an embodiment, an optional doping region 125 can be formedat the first side 112 of the carrier wafer 110 prior to bonding thedevice wafer 110 to the carrier wafer 120. The optional doping region125 can be in direct contact with the region 112 a of the device wafer110 having a reduced Oi concentration. The doping region 125 can be, forexample, of p-type and functions as dopant source for out-diffusion intothe device wafer 110 for forming a backside emitter region. The optionaldoping region 125 is not formed in the embodiment shown in FIG. 7B.

According to an embodiment, the doping region 125 can be of n-type.According to another embodiment, the doping region 125 includesp-dopants and n-dopants which can be implanted, for example, atdifferent depth. For example, n-dopants are typically used to form anoptional field stop layer within the device waver 110. For example,p-dopants are typically used to form the backside emitter region. Thelocation of these doping regions (n-type field stop layer and p-typebackside emitter region) can be controlled through the selections of therespective dopants and the implantation depth in the carrier wafer 120.As p- and n-dopants have different coefficient of diffusion, bothdiffuse at different rate into the device wafer 110 so that therespective n- and p-doping regions are formed at a different depth inthe device wafer 110.

Optionally, the carrier wafer 120 can be provided with a capping layer,for instance nitride, at least at its first side 121 to avoidout-diffusion of oxygen from the carrier wafer 120 into the device wafer110 if, for example, the carrier wafer 120 was not subjected to thethird high temperature process.

Bonding the carrier wafer 120 to the device wafer 110 can be carried outby hydrophilic or hydrophobic processes.

Furthermore, either the first side 121 of the carrier wafer 120 or thesecond side 112 of the device wafer 110, or both of these sides 121,112, can be provided with an oxide layer to facilitate bonding.Alternatively, no oxide layers are provided so that exposedsemiconductor surfaces of the device wafer 110 and the carrier wafer 120are bonded with each other.

According to an embodiment, an optional nitride layer can be formedeither on the first side 121 of the carrier wafer 120 or on the secondside 112 of the device wafer 110, or both of these sides 121, 112.

The thickness of the carrier wafer 120 can be selected such that thethickness of the substrate wafer 100, which includes the device wafer110 and the carrier wafer 120, is in the typical range of a wafer. Thetypical range intends to describe that the thickness of the substratewafer 100 is such that the substrate wafer 100 is mechanically stableenough to be handled without an additional supporting wafer. Forexample, the thickness of the substrate wafer 100 can be in a range ofabout 725 μm for a 200 mm large substrate wafer to avoid adaptation ofthe process equipment which would otherwise be needed due to a differentthickness.

The carrier wafer 120 is, according to an embodiment, of the sameintrinsic doping type as the device 110 to avoid any contamination ofthe device wafer 110. As explained above, the carrier wafer 120 can befrom the same ingot as the device wafer 110 and does not need to meetthe specification regarding resistivity and Oi concentration. Suchwafers are typically discarded by the ingot manufacturer. The use ofsuch discarded wafers reduces the total costs for the substrate wafer100 in comparison to the case where the substrate wafer 100 would becompletely formed by a device wafer meeting the specification regardingresistivity and Oi concentration since the device wafer 110 can be muchthinner than the substrate wafer 100. An optional oxide and/or nitridelayer at the bonding interface avoids any undesired diffusion of dopantsfrom one wafer to the other.

As shown in FIG. 1D, and also in FIG. 7C, the first side 101 of thesubstrate wafer 100, which is formed by the first side 111 of the devicewafer 110, can be processed to reduce the thickness of the device wafer110 to a second thickness d2 which is less than the first thickness d1of the device wafer 110. For example, the second thickness d2 of thedevice wafer 100 is less than 400 μm, for example less than 200 μm oreven less than 150 μm, and typically in the range for the finalthickness of the semiconductor devices to be integrated into the devicewafer 110. The processed first side of the device wafer is indicated at111 p which also forms the processed first side 101 p of the substratewafer 100.

Processing the first side 111 includes, for example,chemical-mechanically polishing, grinding and etching.

According to an embodiment, a laser thermal anneal process using a laser190 can be carried out after processing the first side 111 p to melt theprocessed first side 111 p to a depth of at least 200 nm, typically to adepth between 400 nm and 4 μm. Melting the first side 111 p by laserremoves crystal defects which may be caused by processing the first side111.

In a further process, the substrate wafer 100 is subjected to a secondhigh temperature process to reduce the oxygen content at least of thedevice wafer 110 bonded to the carrier wafer 120.

The second high temperature processes can be carried out at the sameprocess conditions as were used for the first high temperature process,or at different conditions. Typically, both the first and second hightemperature processes are carried out for 1 h to 20 h at a temperaturebetween 1000° C. to 1300° C. in an inert atmosphere, or alternatively,for 1 h to 20 h at a temperature of equal to or less than 1100° C. in anoxidizing atmosphere. It is also possible to carry out one of the firstand second high temperature processes in an inert atmosphere and theother one of the first and second high temperature processes in anoxidizing atmosphere.

With reference to FIG. 5, the effect of the first and second hightemperature processes and the intermediate processing step to reduce thethickness of the device wafer 110 on the Oi concentration is explained.

The device wafer 110 has the initial thickness d1. The initial Oiconcentration before the first and second high temperature processes isindicated by the straight vertical line 71. The first high temperatureprocess reduces the Oi concentration in regions close to the first andsecond side 111, 112 of the device wafer 110. The resulting Oiconcentration distribution after the first high temperature process isillustrated by the dashed curve 72. The Oi concentration is reduced inregions 111 a, 112 a which are at the first and the second side 111,112, respectively, of the device wafer 110. A central region 110 a ofthe device wafer 110 remains at the initial Oi concentration 71. At thisstage, the device wafer 110 is not yet bonded to the carrier wafer 120.

After bonding the device wafer 110 to the carrier wafer 120 andprocessing the first side 111 of the device wafer 110 to thin the devicewafer 110 to the thickness d2, a portion of the central region 110 a isexposed at the processed side 111 p of the device wafer 110. Uponsubjecting the thinned device wafer 110 to the second high temperatureprocess, oxygen is diffused out from the processed first side 111 pwhich results in the Oi concentration distribution as illustrated by thedotted-dashed curve 73. Since the second side 112 of the device wafer110 is bonded to the carrier wafer 120, no oxygen, or only a smallproportion of oxygen, diffuses out at the second side of the devicewafer 110. In the case of a significant reduced oxygen concentration inthe carrier wafer, a significant faster out diffusion of oxygen out ofthe second side of the device wafer is enabled.

The two high temperature processes with the intermediate thinningprocess thus results in a significant reduction of the Oi concentrationthroughout the device wafer 110.

The second high temperature process can also serve for out-diffusing thep-dopants and/or n-dopants from the carrier wafer 120 into the devicewafer 110 to form the p-doped backside emitter region and/or the n-dopedfield stop layer. An additional thermal out-diffusion process is notneeded but can be carried out if desired.

The combination of the first and second high temperature processesresults in a reduction of the Oi concentration by a factor of at least2, particularly of at least 5 or even of at least 10. The resulting Oiconcentration in thickness direction of the device wafer 110, andtherefore also of the final semiconductor devices, has a distributionwith a local maximum in a central portion, which local maximum is aboutat least 2-times, for example 2-times to 5-times, and typically at least3-times larger than the Oi concentration at the respective surfaces ofthe device wafer 110 and the semiconductor chip of the final device.

The device wafer 110 and the semiconductor substrate of the finalsemiconductor device, respectively, can have an Oi concentration along athickness line of the device wafer or of semiconductor substrate,respectively, which has a global maximum at a position of 20% to 80%,particularly 30% to 70%, more particularly 40% to 60%, of the thicknessrelative to the first side 111 p, wherein the local maximum is at least2-times larger, particularly at least 5-times larger, than the oxygenconcentrations at each of the first side 111 p and the second side 112of the device wafer 110 or of the semiconductor substrate of the finalsemiconductor device. The thickness line is normal to the main surfaceor side of the device wafer 110.

The local maximum of the Oi concentration provides a benefit as itallows a local increase of the n-doping concentration using a separatetemperature process at a later stage. The separate temperature processcan be carried out, for example, for several hours at intermediatetemperatures between, for example, 420° C. to 470° C. During thisseparate temperature process, the oxygen atoms, which form thermaldonators, are activated and therefore locally increases the n-dopingconcentration of the device which is beneficial for the switchingbehaviour of the final semiconductor device.

According to an embodiment, as illustrated in FIG. 1E, the rim 116 ofthe device wafer 110 can be optionally processed after reducing thethickness of the device wafer 110. Typically, wafers are provided withrounded edges. When two wafers of the same size are bonded to eachother, a circumferential recess is formed by the two wafers. The recess199 is illustrated in the enlarged portion of FIG. 1E. When one of thewafers, in the present case the device wafer 110, is thinned, a sharprim 116 is formed with a sharp circumferential upper edge 119 as bestshown in the enlarged portion of FIG. 1E. As this sharp rim 116 couldeasily break and thus could be a source for cracks extending into thecentre of the device wafer 110, the rim 116 is ground to form a roundrim 117 as illustrated in the enlarged portion of FIG. 1E.

According to an embodiment, a carrier wafer 120 having a larger diameterthan the device wafer 110 can be alternatively used so that the largercarrier wafer 120 laterally projects the device wafer 110 and thusprotects the rim 116 of the device wafer 110.

In a further process, as illustrated in FIG. 1F, and also in FIG. 7D, atleast one semiconductor component 140, typically a plurality ofsemiconductor components 140, is at least partially integrated into thedevice wafer 110 after the second high temperature process. This isillustrated by the respective doping regions 141 of the semiconductorcomponents 140. A skilled person will appreciate that each semiconductorcomponent 140 can include more than one doping region, typically atleast two doping regions of different conductivity type to form at leastone pn-junction.

According to an embodiment, as illustrated in FIG. 1G, the carrier wafer120 is removed completely or at least partially after partially orcompletely integrating the semiconductor component 140. Finally, a frontmetallization 151 and a back metallization 152 are formed on theprocessed first side 111 p and the second side 112 of the device wafer110. The front metallization 151 and the back metallization 152 are inohmic contact with the respective doping regions of the semiconductordevices 140.

With respect to FIGS. 2A to 2J a further embodiment is described. Toavoid repetition, reference is made to the embodiment of FIGS. 1A to 1Gfor processes which are similar to processes of the FIGS. 1A to 1G.

As illustrated in FIG. 2A, a device wafer 110 with a first side 111 anda second side 112 is provided as described above. The device wafer 110has an initial Oi concentration. The thickness d1 of the device wafer110 is in the above given range and is particularly thinner than neededfor securely handling the device wafer 110.

FIG. 2B illustrates the first high temperature process which formsregions 111 a and 112 a with reduced Oi concentration at the first andsecond side 111, 112, respectively. Different thereto, a central region110 a of the device wafer 110 remains at the initial Oi concentration.

According to an embodiment, as illustrated in FIG. 2C, at least one ofan epitaxial layer 113 and a doped region 113 is optionally formed onthe second side 112 of the device wafer 110 prior to bonding the devicewafer 110 to the carrier wafer 120. The epitaxial layer or doping region113 can form a backside emitter region or a field stop layer.Furthermore, both a backside emitter and a field stop layer can beformed. The depth of the field stop layer and/or the backside emittercan be adjusted by controlling the implantation depth and byappropriately selecting the dopants having a given diffusion rate.

Optionally, a layer containing dopants such as phosphor can be depositedon the second surface 112. This dopant layer acts as a source fordopants which diffuses into the device wafer 110 during any of thesubsequent thermal processes. For example, a backside emitter can beformed using the dopant layer. The dopant layer can be removed at alater stage, for example prior to bonding.

According to an embodiment, as illustrated in FIG. 2D, an optionaloxygen barrier 114 is formed on at least one of the second side 112 ofthe device wafer 110 and the first side 121 of the carrier wafer 120prior to bonding the device wafer 110 to the carrier wafer 120. Theoxygen barrier 114 can be, for example, a nitride layer. Additionally,an optional oxide layer can be formed, for example by CVD or thermalprocesses. The thermal processes should be carried out at temperaturesat which the maximum saturation of oxygen is as low as possible to avoidthat oxygen diffuses back into the device wafer 110 at later processsteps. Typically, the temperature for the thermal processes is at least400° C., particularly at least 700° C. Typically, the temperature isless than 1100° C.

The oxygen barrier 114 can have a thickness of about 500 nm to about 300nm, typically of about 100 nm.

Parallel to the above processes, a carrier wafer 120 is provided havinga first and a second side 121, 122 as illustrated in FIG. 2E. Thecarrier wafer 120 does not need to meet the specification as desired forthe device wafer 110. The carrier wafer 120 is made of a semiconductormaterial as described above, typically of the same semiconductormaterial as the device wafer 110.

FIG. 2F illustrates a third high temperature process to reduce theoxygen content, i.e. the Oi concentration, of the carrier wafer 120prior to bonding the device wafer 110 to the carrier wafer 120 asdescribed above. The third high temperature process forms regions 121 a,122 a with reduced Oi concentration at the first and second side 121,122 of the carrier wafer 120.

Furthermore, the first side 121 of the carrier wafer 120 can be providedwith a doping layer. Moreover an oxide layer, which forms a bond oxide,can be formed on the first side 121 of the carrier wafer 120 or on thesecond side 112 of the carrier wafer 110.

As illustrated in FIG. 2G, the second side 112 of the device wafer 110is bonded to the first side 121 of a carrier wafer 120 to form asubstrate wafer 100. The substrate wafer 100 thus includes the devicewafer 110 bonded to the carrier wafer 120. The second side 122 of thecarrier wafer 120 forms the second side 102 of the substrate wafer 100,and the first side 111 of the device wafer 110 forms the first side 101of the substrate wafer 100.

In a further process, as illustrated in FIG. 2H, the first side 101 ofthe substrate wafer 100, which is formed by the first side 111 of thedevice wafer 110, is processed, for example ground or polished, toreduce the thickness of the device wafer 110 to a second thickness d2which is less than the first thickness d1 of the device wafer. This isdescribed in detail further above.

A melting laser thermal anneal process can be employed to remove crystaldefects after thinning as described above. The final thickness d2 of thedevice wafer 110 is typically less than 400 μm, particularly less than200 μm or less than 150 μm.

In a further process, as illustrated in FIG. 2I, the substrate wafer 100is subjected to a second high temperature process to reducing the oxygencontent at least of the device wafer 110. As a result, the device wafer110 is completely formed by a region 112 a having a reduced Oiconcentration as described in detail in connection with FIGS. 3 and 5.

In a further process, as illustrated in FIG. 2J, semiconductor devicesare integrated into the device wafer 110, which remains bonded to thecarrier wafer 120 during these processes.

In addition to that, the carrier wafer 120 is removed, for example byetching or by CMP processes using the oxygen barrier 114, for examplethe nitride layer, or the bond oxide as etch stop.

Using the oxygen barrier 114 and/or the bond oxide as etch stop reducesthe thickness variation of the final semiconductor devices. Furthermore,as both the thinning process of FIG. 2H and the removal process of FIG.2J are carried out when typically no additional layers such asstructured field oxide layers or metallization layers are formed on thedevice wafer 110, the device wafer 110 has flat surfaces which isbeneficial for an even thickness reduction. The final semiconductordevices can therefore have a significantly reduced thickness variation.

The processes described herein also allow the formation of the backsideemitter and/or the field stop layer at an early stage of themanufacturing process. Formation processes for the backside emitterand/or the field stop layer are usually carried out after the backsideof a wafer is finally polished down to the final thickness, i.e. whenthe wafer is thin. As thin wafers are prone to breakage, formation ofthe backside emitter and/or the field stop layer at a stage where thedevice wafer 110 has a thickness d1 larger than the final thickness d2,the number of so-called “thin wafer processes” can be reduced and theproduction efficiency, due to the reduced likelihood of breakage, can beincreased.

According to an embodiment, the oxygen barrier 114 and/or the bond oxidecan be used as a mask after removal of the carrier wafer 120, forexample after photolithographic structuring of the oxygen barrier 114and/or the bond oxide.

Furthermore, the oxygen barrier 114 and/or the bond oxide can beoptionally used as protective layer during further processes to protectthe second side 112 of the device wafer 110, for example againstmechanical impacts such as scratches and/or against contamination. Theoxygen barrier 114 and/or the bond oxide can then be removed at a laterstage, for example prior to forming the back metallization.

In addition to that, the backside emitter can be formed by using adoping layer formed on the first side 121 of the carrier wafer 120 fromwhich dopants diffuses into the device wafer 110 during processing.

According to an embodiment, a getter layer can be formed on the firstside 121 of the carrier wafer 120. The getter layer remains duringprocessing, at least until the carrier wafer 120 is removed. The getterlayer is beneficial for gettering metallic impurities which may bepresent in the device wafer 110. The getter layer can be formed, forexample, close to the first side 121 of the carrier wafer 120 to improvethe gettering efficiency. Additionally, or alternatively, the getterlayer can also be formed on the substrate wafer 100, for example on thesecond side 102 of the substrate wafer 100.

Optionally or additionally, the getter layer can also be formed on thedevice wafer 110.

With reference to FIGS. 6A to 6C a further embodiment is described.

FIG. 6A illustrates a monocrystalline ingot 300 of a semiconductormaterial which is typically a CZ ingot or an MCZ ingot. In a furtherprocess, the oxygen concentration distribution of the ingot 300, or ofdifferent ingots 300, is determined. In addition to that oralternatively, the resistivity distribution of the one or moremonocrystalline ingots 300 is determined. This determination results inthe identification of regions 301, 302 of different Oi concentrationand/or regions of different intrinsic resistivity. In the following, theembodiment is described relative to the Oi concentration. A skilledperson will appreciate that the embodiment can also be carried out basedon the determination of the intrinsic resistivity.

In a further process, at least a first region 301 of the one or moremonocrystalline ingots 300 which has an oxygen concentration below agiven oxygen threshold (or has a resistivity within a given resistivityrange) is selected. Furthermore, at least a second region 302 of the oneor more monocrystalline ingots 300 which has an oxygen concentrationabove the given oxygen threshold (or has a resistivity outside a givenresistivity range) is selected.

According to an embodiment, the oxygen threshold for the Oiconcentration is 5*10¹⁷/cm³, particularly equal to or less than3*10¹⁷/cm³.

According to an embodiment, the given resistivity range is between 20Ohm*cm to 240 Ohm*cm. For example, the given resistivity range can be 30Ohm*cm+/−30%, or 30 Ohm*cm+/−15%, or 30 Ohm*cm+/−8%, or 60 Ohm*cm+/−30%,or 60 Ohm*cm+/−15%, or 60 Ohm*cm+/−8%, or 120 Ohm*cm+/−30%, or 120Ohm*cm+/−15%, or 120 Ohm*cm+/−8%, or 180 Ohm*cm+/−30%, or 180Ohm*cm+/−15%, or 180 Ohm*cm+/−8%. When referring to a given resistivityrange, the local resistivity can exhibit a distribution of theresistivity values. The above given examples indicates the resistivitydistribution by its centre value (arithmetic mean) and its total range(maximum value to minimum value), for example 30 Ohm*cm+/−15%.

In further processes, as illustrated in FIG. 6B, the first region 301and the second region 302 are sliced to form at least a firstsemiconductor wafer 310 and a second semiconductor wafer 320. The firstand second semiconductor wafers 310, 320 can have the same thickness orcan be of different thickness. FIG. 6B illustrates an embodiment wherethe first semiconductor wafer 310 is thinner than the secondsemiconductor wafer 320.

According to an embodiment, the Oi concentration of the firstsemiconductor wafer 310 can be below the oxygen threshold, and the Oiconcentration of the second semiconductor wafer 320 can be above theoxygen threshold. According to an embodiment, the Oi concentration ofthe first semiconductor wafer 310 is lower than the Oi concentration ofthe second semiconductor wafer 320 by at least 5%, particularly by atleast 10%, and more particularly by at least 20%, relative to the Oiconcentration of the second semiconductor wafer 320.

According to an embodiment, the first region 301 and the second region302 of the one or more monocrystalline ingots 300 are sliced such toprovide the first semiconductor wafer 310 with a thickness which is lessthan a thickness of the second semiconductor wafer 320. The firstsemiconductor wafer 310 typically forms the device wafer 110 as it meetsthe desired specification for manufacturing semiconductor devices suchas power devices. The second semiconductor wafer 320 typically forms thecarrier wafer 120.

The first and second semiconductor wafers 310, 320 differ from eachother at least in their Oi concentration and/or their intrinsicresistivity.

The first and second semiconductor wafers 310, 320 are bonded to eachother as illustrated in FIG. 6C to form a substrate wafer 330 asdescribed above.

This approach efficiently uses the material of the ingot 300 since alsoportions of the ingot having properties outside of the desired rangesare employed. This significantly increases the yield and thus reducesthe manufacturing costs and allows the usage of CZ or MCZ ingots for themanufacturing of semiconductor devices which has high demands regardingthe initial electrical and chemical properties of the starting wafermaterial.

The above processes allow manufacturing of semiconductor devices withsuperior electrical characteristics. The semiconductor devices show aspecific Oi concentration distribution as illustrated in and explainedin connection with FIG. 5. The Oi concentration distribution can be, forexample, verified by suitable detecting methods such as SIMS or infraredspectroscopy.

Particularly power semiconductor devices such as bipolar devices, forexample diodes and IGBTs, benefit from the above manufacturingprocesses. Furthermore, unipolar devices, for example Power-MOSFETs,also benefit from the above manufacturing processes.

The manufacturing processes employ semiconductor material grown frommolten material held in a crucible such as CZ or MCZ processes. Thesemiconductor material is subjected to at least one, typically twooxygen out-diffusion processes to reduce the Oi concentration below acritical threshold for the formation of thermal donators. Thesemiconductor material (semiconductor wafer) is thinned between the twooxygen out-diffusion processes. Optionally, one or more epitaxial layersand/or one or more doping regions can be formed.

A significant benefit provided by the manufacturing processes is thatthe device wafers 110 can be thinner since the device wafers 110 aresupported by carrier wafers 120 which do not need to have the desiredcharacteristics. Therefore, the semiconductor material of the ingot ismore efficiently used and the number of suitable device wafers, whichfulfil the specific characteristics regarding Oi concentration orintrinsic resistivity and which can be obtained from one ingot, isincreased. This increases the yield per ingot.

The semiconductor device 200 as illustrated in FIG. 4 is a bipolar powersemiconductor device and includes an IGBT without being limited thereto.Alternative bipolar devices are, for example, diodes. Furthermore, thesemiconductor device 200 can also be an unipolar power semiconductordevice, for example a Power-MOSFET.

The semiconductor device 200 typically includes a plurality field-effectstructures each forming a respective transistor cell of the IGBT. Thefield-effect structures together form a three-terminal device havingseparate terminals for the gate, source and emitter.

The semiconductor device 200, which is an IGBT in the present embodimentwithout being limited thereto, includes a semiconductor substrate 210,particularly a monocrystalline silicon substrate, having a first side211, a second side 212 opposite the first side 211, and a thickness d2.At least one semiconductor component is integrated in the semiconductorsubstrate 210.

The semiconductor device 200 is a three-terminal power bipolarsemiconductor device. The semiconductor device 200 can also be atwo-terminal power bipolar semiconductor device such as a diode. Thesedevices are typically vertical components having at least one electrodeformed by a first or front metallization 251 at the first side 211 ofthe semiconductor substrate 210 (source metallization for example), andat least a second or back metallization 252 (emitter metallization forexample) at the second side 212 of the semiconductor substrate 210.

The semiconductor device 200 further includes gate electrodes 231arranged in trenches 230 which are formed in the semiconductor substrate210. Gate dielectrics 232 electrically insulate the gate electrodes 231from the semiconductor substrate 210. A mesa region 239 is formedbetween adjacent trenches 230. The semiconductor device further includesa first doping region (n-doped source region) 241, a second dopingregion (p-doped body region) 242, a third doping region (weakly n-dopeddrift region 243), a fourth doping region (n-doped field stop region)244, and a fifth doping region (p-doped emitter region) 245. In case ofa Power-MOSFET, the fifth doping region 245 is an n-doped drain region.

The semiconductor substrate 210 has an oxygen concentration along athickness line (which would be a vertical line in FIG. 4) of thesemiconductor substrate 210 which has a global maximum at a position of20% to 80% of the thickness of the semiconductor substrate 210 relativeto the first side 211. The global maximum is at least 2-times larger,particularly at least 5-times larger, than the oxygen concentrations ateach of the first side 211 and the second side 212 of the semiconductorsubstrate 210 as described, for example, in connection with FIG. 5.

The global maximum of the oxygen concentration can be, for example, lessthan 5*10¹⁷/cm³, particularly equal to or less than 3*10¹⁷/cm³.

The semiconductor device 200 further includes a gate poly 236 and aplurality of gate contacts 237 in ohmic connection with the gateelectrodes 231. The gate poly 236 and the gate contacts 237 areelectrically insulated from the first or front metallization by aninsulation layer 235. The insulation layer 235 includes openings forsource contacts 253 which electrically connect the first metallization251 with the source regions 241.

Spatially relative terms such as “under”, “below”, “lower”, “over”,“upper” and the like, are used for ease of description to explain thepositioning of one element relative to a second element. These terms areintended to encompass different orientations of the device in additionto different orientations than those depicted in the figures. Further,terms such as “first”, “second”, and the like, are also used to describevarious elements, regions, sections, etc. and are also not intended tobe limiting. Like terms refer to like elements throughout thedescription.

As used herein, the terms “having”, “containing”, “including”,“comprising” and the like are open ended terms that indicate thepresence of stated elements or features, but do not preclude additionalelements or features. The articles “a”, “an” and “the” are intended toinclude the plural as well as the singular, unless the context clearlyindicates otherwise. With the above range of variations and applicationsin mind, it should be understood that the present invention is notlimited by the foregoing description, nor is it limited by theaccompanying drawings. Instead, the present invention is limited only bythe following claims and their legal equivalents.

REFERENCE LIST

-   61/62 oxygen concentration-   71 initial Oi concentration-   72 Oi concentration after the first high temperature process-   73 initial Oi concentration after the second high temperature    process-   100 substrate wafer-   101 first side of substrate wafer-   101 p processed first side of substrate wafer-   102 second side of substrate wafer-   110 device wafer-   110 a region with initial Oi concentration-   111 a/112 a region with reduced Oi concentration-   111 first side of device wafer-   111 p processed first side of device wafer-   112 second side of device wafer-   113 epitaxial region/doping region-   114 barrier layer/nitride layer-   116 sharp rim-   117 rounded rim-   118 optional oxygen layer-   119 circumferential upper edge-   120 carrier wafer-   120 a unoxidized region-   121 a/122 a oxide layer/region with reduced Oi concentration-   121 first side of carrier wafer-   122 second side of carrier wafer-   125 p-doped region-   140 semiconductor component-   141 doping region-   151 front metallization-   152 back metallization-   190 laser-   199 recess-   200 semiconductor device-   210 device wafer/semiconductor substrate-   211 first side of device wafer/semiconductor substrate-   212 second side of device wafer/semiconductor substrate-   230 trench-   231 gate electrode-   232 gate dielectric-   235 insulation layer-   236 gate poly-   237 gate contact-   239 mesa-   241 first doping region/source region-   242 second doping region/body region-   243 third doping region/drift region-   244 fourth doping region/field stop region-   245 fifth doping region/emitter region-   251 front metallization/source metallization-   252 back metallization/emitter metallization-   253 source contact-   300 monocrystalline ingot-   301 first region-   302 second region-   310 first semiconductor wafer/device wafer-   320 second semiconductor wafer/carrier wafer-   330 substrate wafer

1. A method for manufacturing a substrate wafer, the method comprising: providing a device wafer having a first side and a second side opposite the first side, the device wafer being made of a semiconductor material and having a first thickness; subjecting the device wafer to a first high temperature process for reducing the oxygen content of the device wafer at least in a region at the second side; bonding the second side of the device wafer to a first side of a carrier wafer to form a substrate wafer comprising the device wafer bonded to the carrier wafer, the carrier wafer having a second side opposite the first side which second side of the carrier wafer forms the second side of the substrate wafer, wherein the first side of the device wafer forms a first side of the substrate wafer; processing the first side of the substrate wafer, which is formed by the first side of the device wafer, to reduce the thickness of the device wafer to a second thickness less than the first thickness of the device wafer; subjecting the substrate wafer to a second high temperature process for reducing the oxygen content at least of the device wafer bonded to the carrier wafer; at least partially integrating at least one semiconductor component into the device wafer after the second high temperature process.
 2. The method of claim 1, further comprising: forming an oxygen barrier on at least one of the second side of the device wafer and the first side of the carrier wafer prior to bonding the device wafer to the carrier wafer.
 3. The method of claim 1, further comprising: subjecting the carrier wafer to a third high temperature process for reducing the oxygen content of the carrier wafer prior to bonding the device wafer to the carrier wafer.
 4. The method of claim 1, wherein providing the device wafer comprises providing the device wafer having an initial interstitial oxygen concentration of equal to or less than 5*10¹⁷/cm³.
 5. The method of claim 1, wherein the first thickness of the device wafer is 300 μm to 850 μm.
 6. The method of claim 1, wherein the second thickness of the device wafer is less than 400 μm.
 7. The method of claim 1, further comprising: processing a rim of the device wafer after reducing the thickness of the device wafer.
 8. The method of claim 1, further comprising: removing the carrier wafer after at least partially integrating the semiconductor component.
 9. The method of claim 1, wherein each of the device wafer and of the carrier wafer has a diameter of at least 150 mm, particularly of at least 200 mm.
 10. The method of claim 1, further comprising: forming an oxide layer on at least one of the first and second side of the device wafer; and removing the oxide layer prior to subjecting the device wafer to the first high temperature process.
 11. The method of claim 1, further comprising: forming at least one of an epitaxial layer and a doped region on the second side of the device wafer prior to bonding the device wafer to the carrier wafer.
 12. The method of claim 1, further comprising: forming a doping region at the first side of the carrier wafer prior to bonding the device wafer to the carrier wafer.
 13. The method of claim 1, wherein the carrier wafer comprises a semiconductor material.
 14. A method for manufacturing a substrate wafer, the method comprising: determining the resistivity distribution of one or more monocrystalline ingots of a semiconductor material, wherein the ingot is particularly a CZ ingot or an MCZ ingot; selecting at least a first region of the one or more monocrystalline ingots having a resistivity within a given resistivity range; selecting at least a second region of the one or more monocrystalline ingots having a resistivity outside a given resistivity range; slicing the first region to form at least a first semiconductor wafer; slicing the second region to form at least a second semiconductor wafer; bonding the first semiconductor wafer to the second semiconductor wafer.
 15. The method of claim 14, wherein the center of the given resistivity range is between 20 Ohm*cm to 240 Ohm*cm and the range around this center is +/−30%.
 16. The method of claim 14, wherein the first region and the second region of the one or more monocrystalline ingots are sliced to provide the first semiconductor wafer with a thickness less than a thickness of the second semiconductor wafer.
 17. A semiconductor device, comprising: a semiconductor substrate, particularly a monocrystalline silicon substrate, having a first side, a second side opposite the first side, and a thickness; at least one semiconductor component integrated in the semiconductor substrate; a first metallization at the first side of the semiconductor substrate; a second metallization at the second side of the semiconductor substrate; wherein the semiconductor substrate has an oxygen concentration along a thickness line of the semiconductor substrate which has a global maximum at a position of 20% to 80% of the thickness relative to the first side, wherein the global maximum is at least 2-times larger than the oxygen concentrations at each of the first side and the second side of the semiconductor substrate.
 18. The semiconductor device of claim 17, wherein the global maximum of the oxygen concentration is less than 5*10¹⁷/cm³.
 19. The semiconductor device of claim 17, wherein the semiconductor device is a bipolar device.
 20. The semiconductor device of claim 17, wherein the semiconductor device is a MOSFET. 